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The oxidation free force air oven is used in bake processes of clean room up Class 100.
The oven is ideal for the products are easy to cause oxidation and prevent the dust adhered during the bake. Apply to electronic industry water remove, glue drying, temping, and preheating, etc. (Such as the processes before and after the IC (Integrated Circuit) embedded, wafer bake, LCD processes, etc.)
The inside wall is manufactured for #304 nonmagnetic mirror effect stainless steel.
The outside wall is manufactured for SS41# mild carbon steel, phosphor acid treated and two layers baking painting treated for avoiding particles.
★ Argon welded Inside Chamber:
The outside wall gap is filled with silicon. Joint between inside and outside wall is filled with silicon for oxygen and dust free drying performance.
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Accessory:
Japanese made HEPA filter for high temperature and humidity resistance (99.97%), With Pressure difference gauge.
★ Laminal Flow Air Circuit:
The saturated pressure inside oven is released to ensure maximum uniformity of temperature distribution
MODEL |
CNCR-1 |
CNCR-2 |
CNCR-3 |
CNCR-4 |
REMARKS |
Inside Dimensions |
40×50×40 |
60×50×60 |
60×50×90 |
80×50×100 |
Room temp. H Model for 350°C
|
Outside Dimensions |
103×72×98 |
85×84×148 |
85×84×178 |
104×113×190 |
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Power Source |
220V 1Ø/3Ø 3KW |
220V 3Ø 5KW |
220V 3Ø/3Ø 7.5KW |
220V 3Ø/3Ø 9KW |
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Heat insulation |
Imported rock wool for heat insulation. (H model is covered with additional 2 layers 1260°C heat resistant ceramic wool) |
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Protection |
Double circuit protections for electronic and mechanic system; Over-temp protection; Dust free model is fitted with pressure difference indication. |
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Air inlet |
N2; CO2 MAX: 25 l/min. (at 0.5 kg/cm2G ; 20°C) |
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